AG15PC252F-K2M [TAIYO YUDEN]
RESISTOR, VOLTAGE DEPENDENT, 2500V, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIANT;
| 型号： | AG15PC252F-K2M |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | RESISTOR, VOLTAGE DEPENDENT, 2500V, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIANT |
| 文件： | 总7页 (文件大小：910K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
スパークギャップ
SPARK GAPS
OPERATING TEMP.
K30VJ85C
特長ꢀFEATURES
Y自己消火性樹脂を用い、安全性が高い
Yもれ電流が極めて小さい
Y静電容量が極めて小さい
YVery safe due to self-extinguishing resin
YLeakage current is very small.
YElectrostatic capacitance is very small.
用途ꢀAPPLICATIONS
YCRT周 辺の異
常電圧吸収
YUsed to absorb abnormal voltages in the periphery of a CRT
形名表記法ꢀORDERING CODE
8
4
6
1
リード形状 [mm]
被覆状態
放電電圧許容差 [V]
形式
AG
形状
間隔
6.4
6.4
5.0
5.0
6.4
6.4
径
長さ
5.0M0.8
24以上
20以上
5.0M1
Q
樹脂キャップなし
樹脂キャップ付
Q= スペース
F
M500
スパークギャップ
H3D
L3N
K2M
K2U
K4M
K4U
Hフォーミング
ストレート
Kフォーミング
Kフォーミング
Kフォーミング
Kフォーミング
0.65
0.65
0.60
0.60
0.60
0.60
C
G
M800
2
外径形状
15
20
5
7
外形寸法毎の各タイプ
20以上
5.0M1
公称放電開始電圧 [VDC]
122
492
包装
QE
SE
ꢀ
ꢀ
1200
4900
20 タイプ単品 f袋詰め g
15 タイプ単品 f袋詰め g
15 タイプテーピング品
3
BE
樹脂材料
P
Q= スペース
アルキド樹脂
A G
1 5 P C 1 2 2 F S K K 2 M
1
2
5
7
8
6
3
4
6
1
4
8
Type
AG
Discharge voltage
Tolerance [V]
Coating conditions
Lead configuration[mm]
Lead type
H-formed
Straight
Lead space
Diameter
Length
5.0M0.8
24Min.
20Min.
5.0M1
Q
without resin cap
with resin cap
Q=Blank space
Spark gaps
H3D
L3N
K2M
K2U
K4M
K4U
C
6.4
6.4
5.0
5.0
6.4
6.4
0.65
0.65
0.60
0.60
0.60
0.60
F
M500
2
G
M800
K-formed
K-formed
K-formed
K-formed
External dimension
15
20
5
7
6
Type by external
dimension
20Min.
5.0M1
Nominal discharge
Packaging
QE
SE
Type 20, bulk
Type 15, bulk
Type 15, taped
starting
voltage[VDC]
3
122
492
1200
4900
BE
Resin material
P
Q=Blank space
Alkyd resin
480
外形寸法ꢀEXTERNAL DIMENSIONS
AG20
Type
AG15
Hフォーミング Formed
リード線
Lead type
Kフォーミング Formed
K2M,K2U,K4M,K4U
ストレート Straight
H3D
L3N
キ
ꢁ
ꢂ
プ
レ
ス
本体の厚
さ
本体の厚
さ
本体の厚
さ
Thickness of bodyD3.5max
Thickness of bodyD4M0.5
Thickness of bodyD4M0.5
8
f0.138maxg
f0.157M0.020g
f0.157M0.020g
キ
ꢁ
ꢂ
プ
付
き
E
本体の厚
さ
本体の厚
さ
本体の厚 さ
Thickness of bodyD4M0.5
f0.157M0.020g
Thickness of bodyD4.7M0.5
f0.184M0.020g
Thickness of bodyD4.7M0.5
f0.184M0.020g
UnitDmmfinchg
アイテム一覧ꢀPART NUMBERSꢀ
放電開始電圧
絶縁抵抗
EHS
形ꢀ式
(Environmental
Hazardous
Discharge starting voltage fDCg
Insulation
resistance
リード形状
Type
公称値
許容差
Lead configuration
Substances)
Nominal value[V]
1200ꢀ1500ꢀ2000
2500
Tolerance[V] [ME]I1
M 500
RoHS
RoHS
10000min Kフォーミング K Formed
AG15PG◯◯◯RG E▽▽▽
AG20PG◯◯◯R E▽▽▽
M 800
M 500
M 800
1200ꢀ1500ꢀ2000
2500
ストレート、Hフォーミング
10000min
Straight ,H Formed
形名のGには被覆状態、◯には放電開始電圧、Rには許容差、☆には包装、▽にはリード形状記号が入ります。
GPlease specify the coating condition code and Z the discharge starting voltage code and R the tolerance code and G the packaging code and ▽ the
lead configuration code.
f注g使用している材料は自己消火性樹脂で、UL94V-0、UL1410fphase ll 規制gを保証するものです。
NoteDThe material used is a self-extinguishing resin conforming to UL94V-0 and UL1410fphase ll regulationg
ꢀꢀꢀI1 AG15、AG20はDC500V20秒以内の値 です。
I1 Values of AG15,AG20 are set at DC500V within 20 seconds.
セレクションガイド
Selection Guide
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信
頼性
使用上の注意
Reliability Data
Precautions
P.14
etc
P.481
P.482
P.483
P.484
P.486
481
特性図ꢀELECTRICAL CHARACTERISTICS
482
梱包ꢀPACKAGING
最小受注単位数 Minimum Quantity
最小受注単位数 Minimum Quantity [pcs]
Type
袋詰め Bulk
1000
テーピング Taped
1300F
AG15
AG20
500
------
※K2Mタイプのみ
※Available for K2M type only
テーピング寸法ꢀfK2MタイプgꢀTaping DimensionsfK2M Typeg
8
寸法
記号
Symbol
A
Dimensions
6.8M0.5 f0.268M0.020g
7.0M0.5 f0.276M0.020g
4.0M0.5 f0.157M0.020g
12.7M1.0 f0.500M0.039g
12.7M0.3 f0.500M0.012g
3.85M0.5 f0.152M0.020g
6.35M1.3 f0.250M0.051g
5.0M0.5 f0.197M0.020g
B
T
P
P0
P1
P2
F
J1.0
K0.5
J0.039
K0.020
18.0
f0.709
g
ꢀ
W
12.0min f0.472ming
W0
W1
W2
H
J0.030
9.0 KJ0.75 f0.354
g
K 0.020
0.5
3.0max f0.118maxg
19.6M0.5 f0.772M0.020g
16.0M0.5 f0.630M0.020g
4.0M0.3 f0.157M0.012g
11.0max f0.433maxg
2.0max f0.079maxg
H0
BD0
L
b
0.75M0.2 f0.030M0.008g
t
Qh1
Qh2
d
2.0max f0.079maxg
0.6M0.05 f0.024M0.002g
UnitDmmfinchg
483
RELIABILITY DATA
SPARK GAPS
Item
Test Methods and Remarks
Specified Value
1.Operating Temperature
Range
ꢀ
K30CVJ85C
2.Operating Humidity Range
95%RH max. fNo dew condensationg
K40CVJ85C
3.Storage Temperature
ꢀRange
4.Discharge Voltage
Within the specified tolerance
10,000 ME min.
With the Circuit 1 shown below, conduct measure-
ment with voltage application.
Applied voltageD500VDC
5.Insulation Resistance
6.Capacitance
DurationDWithin 20 sec.
1pFmax.
Measuring frequencyD1M0.1MHz
Measuring voltageD0.5V5.0Vrms
Bias applicationDNone
8
With the Circuit 2 shown below, repeat discharge
with specified voltage, followed by the measurement
within 2 to 5 hrs.
7.Discharge
Discharge
ꢀLife
J20
Voltage
L
K35
Change
Number of dischargeD10,000 times
Insulation
5000ME
Resistance
TemperatureD40M2C
8.Damp Heat
Discharge
HumidityD90V95LRH
J50
L
K30
Voltage
Change
DurationD250 hrs
RecoveryD2 to 5 hrs of recovery under the standard
condition after the removal from test chamber.
Insulation
Resistance
5000ME
9.Terminal
No damage
Apply the tensile force in the direction to draw terminal.
ꢀStrength
Applied forceD9.8N
Tensile
Apply the bending force to incline the body to right and left
through angle of 90°
No damage
Torsional
Applied forceD4.9N
Circuit 1
Circuit 2
AG15、AG20
RD20ME
AG15、AG20
RD20ME
CD2000pF
CD10000pF
EDRefer to individual specification
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20M2C
of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
485
1/2
PRECAUTIONS
Precautions on the use of Spark Gaps
Stages
Precautions
Technical considerations
1. Circuit Design
SVerification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear re-
actors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any Spark Gaps to be
used in such equipment may require higher safety and/or reli-
ability considerations and should be clearly differentiated from
components used in general purpose applications.
SVerification of Rated voltage (DC rated voltage)
1. Spark Gaps has determined electric discharge voltage be-
tween metaled Electrode using the insulation resistance of air.
Therefore, since a life changes with the energies of input serge,
please give me examination enough in the case of use.
2. Since between the Electrode will be in a short state at the time
of electric discharge, when using it for a low impedance cir-
cuit, the Follow Current occurs and reduce the life of Spark
Gaps remarkably. In such a case, please connect low resis-
tance or a capacitive varistor in series.
8
3. Since the voltage which starts electric discharge when the
early serge of a standup is actually impressed, since electric
discharge delay generates Spark Gaps may become higher
than the specified electric discharge start voltage, cautions
are required.
4. Since Spark Gaps was developed for serge with small en-
ergy, when using it as an object for guidance thunder absorp-
tion with the big energy generated on a commercial power
supply line, telephone / communication line, etc., it requires
cautions enough.
SOperating Environment precautions
1. Spark Gaps should not be used in the following environments:
(1)Environmental conditions to avoid
a. exposure to water or salt water.
b. exposure to moisture or condensation.
c. exposure to corrosive gases (such as hydrogen sulfide, sulfu-
rous acid, chlorine, and ammonia)
1. When Spark Gaps are mounted onto a PC board, hole dimen-
sions on the board should match the lead pitch of the compo-
nent, if not it will cause breakage of the terminals or cracking
of terminal roots covered with resin as excess stress travels
through the terminal legs. As a result, humidity resistance
performance would be lost and may lead to a reduction in
insulation resistance and cause a withstand voltage failure.
2. PCB Design
3. Considerations for automatic
insertion
SAdjustment Automatic Insertion machines (leaded components)
1. When inserting Spark Gaps in a PC board by auto-insertion
machines the impact load imposed on the capacitors should
be minimized to prevent the leads from chucking or clinching.
487
2/2
PRECAUTIONS
Precautions on the use of Spark Gaps
Stages
Precautions
Technical considerations
1. Flux is used to increase solderability in wave soldering, but if too much is applied, a large
amount of flux gas may be emitted and may detrimentally affect solderability. To mini-
mize the amount of flux applied, it is recommended to use a flux-bubbling system.
2. With too much halogenated substance (Chlorine, etc.) content is used to activate the
flux, an excessive amount of residue after soldering may lead to corrosion of the terminal
electrodes or degradation of insulation resistance on the surface of the capacitors.
3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the
residue on the surface of capacitors in high humidity conditions may cause a degrada-
tion of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered
carefully when selecting water-soluble flux.
4. Soldering
SSelection of Flux
1. When soldering Spark Gaps on the board, flux should be ap-
plied thinly and evenly.
2. Flux used should be with less than or equal to 0.1 wt% (equiva-
lent to Chroline) of halogenated content. Flux having a strong
acidity content should not be applied.
3. When using water-soluble flux, special care should be taken
to properly clean the boards.
SWave Soldering
1. If Spark Gaps are used beyond the range of the recommended conditions, heat stresses
may cause cracks inside the Spark Gaps, and consequently degrade the reliability of the
Spark Gaps.
1.Temperature, time, amount of solder, etc. are specified inꢀ
accordance with the following recommended conditions.
2. Do not immerse the entire Spark Gaps in the flux during the
soldering operation. Only solder the lead wires on the bottom
of the board.
8
1. The resin material used for the outer coating of capacitors is occasionally a wax sub-
stance for moisture resistance which can easily be dissolved by some solutions. So
before cleaning, special care should be taken to test the component’s vulnerability to the
solutions used.
5. Cleaning
SBoard cleaning
1. When cleaning the mounted PC boards, make sure that cleaning
conditions are consistent with prescribed usage conditions.
When using water-soluble flux please clean the PCB with purified water sufficiently and
dry thoroughly at the end of the process. Insufficient washing or drying could lower the
reliability of the capacitors.
6. Post-cleaning-process
SApplication of resin molding, etc. to the PCB and components. 1-1. The thermal expansion and coefficient of contraction of the molded resin are not neces-
sarily matched with those of the Spark Gaps. The Spark Gaps may be exposed to
1. Please contact your local Taiyo Yuden sales office before per-
stresses due to thermal expansion and contraction during and after hardening. This
forming resin coating or molding on mounted capacitors.
may lower the specified characteristics and insulation resistance or cause reduced with-
Please verify on the actual application that the coating pro-
stand voltage by cracking the ceramic or separating the coated resin from the ceramics.
cess will not adversely affect the component quality.
1-2. With some types of mold resins, the resin's decomposition gas or reaction gas may
remain inside the resin during the hardening period or while left under normal condi-
tions, causing a deterioration of the capacitor's performance.
1-3. Some mold resins may have poor moisture proofing properties. Please verify the
contents of the resins before they are applied.
1-4. Please contact Taiyo Yuden before using if the hardening process temperature of the
mold resins is higher than the operating temperature of the Spark Gaps.
7. Handling
SMechanical considerations
1. Because the Spark Gaps is made of ceramic, mechanical shocks applied to the board
may damage or crack the Spark Gaps.
1. Be careful not to subject the Spark Gaps to excessive me-
chanical shocks. Withstanding voltage failure may result.
2. If Spark Gaps are dropped onto the floor or a hard surface
they should not be used.
2.Spark Gaps which are dropped onto the floor or a hard surface may develop defects and
have a higher risk of failure over time.
8. Storage conditions
SStorage
1. Under high temperature/high humidity conditions, the decrease in solderability due to
the oxidation of terminal electrodes and deterioration of taping and packaging character-
istics may be accelerated.
1. To maintain the solderability of terminal electrodes and to keep
the packaging material in good condition, care must be taken
to control temperature and humidity in the storage area. Hu-
midity should especially be kept as low as possible. Recom-
mended conditions: Ambient temperature Below 40 C Humid-
ity Below 70% RH. Products should be used within 12 months
after delivery. After the above period, the solderability should
be checked before using the Spark Gaps.
2. Spark Gaps should not be kept in an environment filled with
decomposition gases such as (sulfurous hydrogen, sulfurous
acid, chlorine, ammonia, etc.)
3. Spark Gaps should not be kept in a location where they may
be exposed to moisture, condensation or direct sunlight.
489
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